Earlier Alarm, Faster Fire-fighting, Less Loss.
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Earlier Alarm, Faster Fire-fighting, Less Loss.
Quality Management
Orena adheres to the PDCA management improvement principle, based on ISO9001:2018 quality management system and IPC-A-600H standard, to optimize the internal management process and to enhance the supply chain management level, in order to ensure that our customers receive high quality products and manufacturing services.
We strictly control the quality control points in the process, NPI product introduction, DFM inspection, PCBA manufacturing and testing, and conduct full training to form a perfect quality management system.
DFM Inspection
Check the following items of design: PCB, BOM, schematic, and finished assembly manual. Document version and last update time Process: leaded/lead-free Clear component part numbers and silkscreen BOM with manufacturer brand and part number, description, and bit number
Confirmation of PCB fabrication process: material, board thickness, copper thickness, number of layers, surface treatment, character color and special processes.
Reasonable PCB layer and board assembly method
Provide correct SMT mounting files
Perfect program burning and function test programme
Clear assembly manuals and schematics for finished products
Other special process requirements
New Product Introduction (NPI)
Organize sales department, engineering department, production department, purchasing department, quality department and other personnel to hold a new product introduction meeting.
Detailed introduction of the project background, product application scope, delivery and special requirements.
Determine the internal customer number and product number. Define the production batch, procurement and delivery quantity. Evaluate the difficulty of the process and key quality control points of the project. Define the procurement cycle of PCB and electronic components. Propose draft production plan. Prepare fixtures, jigs and auxiliary materials for the production process. Define the test plan for the products.
PCB Production
We strictly control the following key quality points:
High quality brand boards Selection of top PCB suppliers Continuously establish supplier relationship management Have the ability to complete the process of 3 mil line width and pitch, multilayer, HDI, impedance, blind buried holes All PCBs delivered to us must be 100% electrically tested.
Purchase of Electronic Components
Procurement of 100% of the brands and material numbers specified in the BOM. Procurement of materials through regular channels such as primary agents and top traders. Can provide the first-class agent certificate of origin Good centralized purchasing advantages, shorter purchasing cycle, latest material year, stocking advantages, etc. Provide perfect technical support from the original factory.
IQC Incoming Material Inspection
Measure the thickness of PCB Check the PCB through-hole and whether the ink is blocked, etc.
Check whether there is warping and deformation of PCB, and whether the silkscreen is clear. Check the PCB for broken wires, skipped wires and other defects. Place the PCB in the reflow soldering oven temperature test, check whether the yellowing or deformation Check whether the batch number, material number and silkscreen of the incoming electronic components are consistent with the BOM. The incoming electronic components are placed on the PCB bare board for pad or through-hole fit test. Random inspection of incoming electronic components resistance, capacitance, etc., and compared with the BOM Check the surface of the incoming electronic components whether there are scratches, deformation, broken legs, short legs and other appearance defects.
Component Storage And Solder Paste Printing
Storage of sensitive components in professional constant temperature and humidity chambers Bake some PCB/IC/BGA with strict requirements for 2-12 hours to remove surface moisture and enhance solderability
Adopting first-class brand solder paste Develop high quality laser stencil Perfect solder paste freezing, thawing and stirring operation procedure. Equipped with fully automatic solder paste printing machine to ensure the consistency and reliability of solder paste printing during mass production.
SMT Mounter
Adopting Samsung series high-speed automatic SMT mounter with accuracy up to 01005 packaging size Component size range: 01005 0.3*0.15 mm²～200*125 mm² Maximum height of processable components: 25.4mm BGA/CSP minimum ball pitch, ball diameter: 0.30mm, 0.15mm Patch accuracy: ±22μm (3σ), ±0.05° (3σ) Processable board size range: conventional 50*50 mm², sampling limit: 850*560 mm². Plate thickness range: 0.3mm–6mm Equipped with 10 temperature zone nitrogen + vacuum reflow soldering furnace, set up qualified furnace temperature curve. Use the oven temperature tester to check the oven temperature every 4 hours and record it Use AOI optical detector for batch detection of wrong parts, missing parts, reverse, false soldering and other defects. Use X-Ray to build up boards containing dense ball BGAs
DIP Plug-In Processing
Strict workstation operating instructions Wave soldering fixtures are prescribed for mass production to ensure the reliability and consistency of soldering
Equipped with 2 plug-in production lines to meet the needs of mass production Equipped with engraving machine, the engineering department according to customer requirements to open the test rack, the ability to complete the mainstream chip programme burning and functional testing.
Reliability Testing
Orena has been committed to providing high quality products to customers in the areas of fire alarm industry where have higher requirements for reliability. The reliability testing items conducted in Orena laboratory include:
Environmental test to assess the adaptability of products under various environmental conditions (vibration, shock, impact, temperature, thermal shock, humidity, salt spray, dust, etc.)
EMC test to check the reliability of the product in a variety of harsh electromagnetic environmental conditions (conducted interference, harmonic current, electrostatic discharge, Surge/lightning strike, voltage drop/interruption, electromagnetic radiation, transient conducted emission, power radiation, voltage fluctuation and flicker, radiation immunity, conducted immunity, interharmonics immunity, electromagnetic radiation immunity (anechoic chamber), transient conducted immunity, magnetic field radiation, electric fast transient pulse group, power frequency magnetic field)
Life test to simulate various service conditions and study the life characteristics of products.
Product Certifications
▶ Strict workstation operating instructions.
▶ Wave soldering fixtures are prescribed for mass production to ensure the reliability and consistency of soldering.
▶ Equipped with 2 plug-in production lines to meet the needs of mass production.
▶ Equipped with engraving machine, the engineering department according to customer requirements to open the test rack, the ability to complete the mainstream chip programme burning and functional testing.
Get in touch with us
Just leave your email or phone number in the contact form so we can send you a free quote for our wide range of designs!
Telephone
+86 755 2678 7499
Whatsapp
+86 186 8201 2815
Skype
barrychang516@163.com
